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| SDP06S60, SDB06S60 SDT06S60 Silicon Carbide Schottky Diode * Worlds first 600V Schottky diode * Revolutionary semiconductor material - Silicon Carbide * Switching behavior benchmark * No reverse recovery * No temperature influence on the switching behavior * Ideal diode for Power Factor Correction up to 1200W 1) * No forward recovery P-TO220-2-2. thinQ! SiC Schottky Diode Product Summary VRRM Qc IF P-TO220-3.SMD 600 21 6 P-TO220-3-1. V nC A Type SDP06S60 SDB06S60 SDT06S60 Package P-TO220-3-1. P-TO220-2-2. Ordering Code Q67040-S4371 Q67040-S4446 Marking D06S60 D06S60 D06S60 Pin 1 n.c. Pin 2 C Pin 3 A P-TO220-3.SMD Q67040-S4370 n.c. C A C Value 6 8.4 21.5 28 60 2.3 600 600 57.6 A Unit A Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Continuous forward current, TC=100C RMS forward current, f=50Hz TC=25C, tp=10ms Symbol IF IFRMS Surge non repetitive forward current, sine halfwave IFSM Repetitive peak forward current Tj=150C, TC=100C, D=0.1 IFRM IFMAX i2dt VRRM VRSM Ptot Tj , Tstg Non repetitive peak forward current tp=10s, TC=25C i 2t value, TC=25C, tp=10ms Repetitive peak reverse voltage Surge peak reverse voltage Power dissipation, TC=25C Operating and storage temperature As V W C -55... +175 Rev. 2.0 Page 1 2004-03-23 SDP06S60, SDB06S60 SDT06S60 Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: P-TO263-3-2: @ min. footprint P-TO263-3-2: @ 6 cm 2 cooling area 2) P-TO252-3-1: @ min. footprint P-TO252-3-1: @ 6 cm 2 cooling area 2) Symbol min. RthJC RthJA RthJA Values typ. 35 max. 2.6 62 62 75 50 Unit - K/W Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Static Characteristics Diode forward voltage IF=6A, Tj=25C IF=6A, Tj=150C Symbol min. VF IR - Values typ. max. Unit V 1.5 1.7 20 50 1.7 2.1 A 200 1000 Reverse current V R=600V, T j=25C V R=600V, T j=150C 1CCM, V = 85VAC, T = 150C, T =100C, = 93%, I = 30% IN j C IN 2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Rev. 2.0 Page 2 2004-03-23 SDP06S60, SDB06S60 SDT06S60 Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Symbol Values min. AC Characteristics Total capacitive charge V R=400V, IF=6A, diF/dt=200A/s, T j=150C Unit max. nC ns pF typ. 21 n.a. Qc trr C - Switching time V R=400V, IF=6A, diF/dt=200A/s, T j=150C Total capacitance V R=0V, T C=25C, f=1MHz V R=300V, T C=25C, f=1MHz V R=600V, T C=25C, f=1MHz - 300 20 15 - Rev. 2.0 Page 3 2004-03-23 SDP06S60, SDB06S60 SDT06S60 1 Power dissipation Ptot = f (TC) 60 2 Diode forward current IF = f (TC) parameter: Tj175 C 6.5 W 50 45 A 5.5 5 4.5 Ptot 40 35 30 25 20 15 10 5 0 0 20 40 60 80 100 120 140 IF C 180 TC 4 3.5 3 2.5 2 1.5 1 0.5 0 0 20 40 60 80 100 120 140 C 180 TC 3 Typ. forward characteristic IF = f (VF) parameter: Tj , tp = 350 s 12 4 Typ. forward power dissipation vs. average forward current PF(AV)=f(IF) TC=100C, d = tp/T W 28 A 10 9 8 PF(AV) 150C 125C 100C 25C -40C 24 22 20 18 16 14 12 10 8 6 4 2 d=0.1 d=0.2 d=0.5 d=1 IF 7 6 5 4 3 2 1 0 0 0.5 1 1.5 V VF 2.5 0 0 2 4 6 8 A 12 IF(AV) Rev. 2.0 Page 4 2004-03-23 SDP06S60, SDB06S60 SDT06S60 5 Typ. reverse current vs. reverse voltage I R=f(VR) 10 2 6 Transient thermal impedance ZthJC = f (t p) parameter : D = t p/T 10 1 SDP06S60 A 10 1 K/W 10 0 ZthJC 150C 125C 100C 25C 10 0 10 -1 IR D = 0.50 10 -1 10 -2 0.20 0.10 0.05 0.02 0.01 10 -2 10 -3 single pulse 10 -3 100 150 200 250 300 350 400 450 500 V 600 VR 10 -4 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 tp 7 Typ. capacitance vs. reverse voltage C= f(V R) 8 Typ. C stored energy EC=f(V R) 3.5 parameter: TC = 25 C, f = 1 MHz 250 J pF 2.5 150 C EC 2 1.5 1 0.5 1 2 3 10 V VR 100 50 00 10 10 10 0 0 100 200 300 400 V VR 600 Rev. 2.0 Page 5 2004-03-23 SDP06S60, SDB06S60 SDT06S60 9 Typ. capacitive charge vs. current slope Q c=f(diF /dt) parameter: Tj = 150 C 22 nC 18 16 IF*2 IF IF*0.5 Qc 14 12 10 8 6 4 2 0 100 200 300 400 500 600 700 800 A/s 1000 diF /dt Rev. 2.0 Page 6 2004-03-23 SDP06S60, SDB06S60 SDT06S60 P-TO220-3-1 P-TO220-3-1 dimensions symbol min A B C D E F G H K L M N P T 9.70 14.88 0.65 3.55 2.60 6.00 13.00 4.35 0.38 0.95 [mm] max 10.30 15.95 0.86 3.89 3.00 6.80 14.00 4.75 0.65 1.32 min 0.3819 0.5858 0.0256 0.1398 0.1024 0.2362 0.5118 0.1713 0.0150 0.0374 [inch] max 0.4055 0.6280 0.0339 0.1531 0.1181 0.2677 0.5512 0.1870 0.0256 0.0520 2.54 typ. 4.30 4.50 1.17 2.30 1.40 2.72 0.1 typ. 0.1693 0.1772 0.0461 0.0906 0.0551 0.1071 TO-220-3-45 (P-TO220SMD) dimensions symbol min A B C D E F G H K L M N P Q R S T U V W X Y Z [mm] max min 9.80 10.00 1.3 typ. 1.25 1.75 0.95 1.15 2.54 typ. 0.72 0.85 5.08 typ. 4.30 1.28 9.00 4.50 1.40 9.40 [inch] max 0.3858 0.3937 0.0512 typ. 0.0492 0.0689 0.0374 0.0453 0.1 typ. 0.0283 0.0335 0.2 typ. 0.1693 0.0504 0.3543 0.1772 0.0551 0.3701 2.30 2.50 14.1 typ. 0.00 0.20 3.30 3.90 8 max 1.70 2.50 0.50 0.65 10.8 typ. 1.35 typ. 6.43 typ. 4.60 typ. 9.40 typ. 16.15 typ. 0.0906 0.0984 0.5551 typ. 0.0000 0.0079 0.1299 0.1535 8 max 0.0669 0.0984 0.0197 0.0256 0.4252 typ. 0.0532 typ. 0.2532 typ. 0.1811 typ. 0.3701 typ. 0.6358 typ. Rev. 2.0 Page 7 2004-03-23 SDP06S60, SDB06S60 SDT06S60 TO-220-2-2 A P D U H B V F W J G E symbol min A B C D E F G H J K L M N P T U V W 9.70 15.30 0.65 3.55 2.60 9.00 13.00 17.20 4.40 0.40 [mm] max 10.10 15.90 0.85 3.85 3.00 9.40 14.00 17.80 4.80 0.60 min 0.3819 0.6024 0.0256 0.1398 0.1024 0.3543 0.5118 0.6772 0.1732 0.0157 N dimensions [inch] max 0.3976 0.6260 0.0335 0.1516 0.1181 0.3701 0.5512 0.7008 0.1890 0.0236 1.05 typ. 2.54 typ. 4.4 typ. 1.10 1.40 2.4 typ. 6.6 typ. 13.0 typ. 7.5 typ. 0.00 0.40 0.41 typ. 0.1 typ. 0.173 typ. 0.0433 0.0551 0.095 typ. 0.26 typ. 0.51 typ. 0.295 typ. 0.0000 0.0157 X L C M T K X Rev. 2.0 Page 8 2004-03-23 SDP06S60, SDB06S60 SDT06S60 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.0 Page 9 2004-03-23 |
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